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  to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation ( http://www.renesas.com ) send any inquiries to http://www.renesas.com/inquiry .
notice 1. all information included in this document is current as of th e date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas electronics products listed herein, please confirm the latest product information with a renesas electronics sales office. also, please pay regular and careful attention to additional and different information to be disclosed by renesas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electronics products or technical information described in this document . no license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property right s of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any renesas electronics product, whether in whole or in part . 4. descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. you should not use renesas electronics products or the technology de scribed in this document for any purpose re lating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. renesas electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing the information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or om issions from the information included herein. 7. renesas electronics products are classified according to the following three quality grades: ?standard?, ?high quality?, an d ?specific?. the recommended applications for each renesas electronics product depends on the product?s quality grade, as indicated below. you must check the quality grade of each renesas electronics product before using it in a particular application. you may not use any renesas electronics product for any application categorized as ?specific? without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. renesas electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intended where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electronics data sheets or data books, etc. ?standard?: computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. ?high quality?: transportation equipment (automobiles, trains, ship s, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specifically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. you should use the renesas electronics products described in this document within the range specified by renesas electronics , especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesas electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use re nesas electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of c ontrolled substances, including without limitation, the eu rohs directive. renesas electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any fo rm, in whole or in part, without prior written consent of renes as electronics. 12. please contact a renesas electronics sales office if you have any questions regarding the information contained in this document or renesas electronics products, or if you have any other inquiries. (note 1) ?renesas electronics? as used in this document means renesas electronics corporation and also includes its majority- owned subsidiaries. (note 2) ?renesas electronics product(s)? means any product developed or manufactured by or for renesas electronics.
rev.1.00, may.13.2 003, page 1 of 10 haf1009(l), haf1009(s) silicon p channel mos fet series power switching rej03g0029-0100z (previous ade-208-1525 (z)) rev.1.00 may.13.2003 description this fet has the over temperature shut?down capability sensing to the junction temperature. this fet has the built?in over temperatur e shut?down circuit in the gate area. and this circuit operation to shut?down the gate voltage in case of high junction temperature like applying over power consumption, over current etc. features ? logic level operation (-4 to -6 v gate drive) ? high endurance capability against to the short circuit ? built?in the over temperature shut?down circuit ? latch type shut?down operation (need 0 voltage recovery) outline gate resistor tempe? rature sencing circuit latch circuit gate shut? down circuit d s g ldpak 1. gate 2. drain 3. source 4. drain 1 2, 4 3 1 2 3 1 2 4 4 3
haf1009(l), haf1009(s) rev.1.00, may.13.2 003, page 2 of 10 absolute maximum ratings (ta = 25c) item symbol ratings unit drain to source voltage v dss ?60 v gate to source voltage v gss ?16 v gate to source voltage v gss 2.5 v drain current i d ?40 a drain peak current i d (pulse) note 1 ?80 a body-drain diode reverse drain current i dr ?40 a channel dissipation pch note 2 50 w channel temperature tch 150 c storage temperature tstg ?55 to +150 c notes: 1. pw 10 s, duty cycle 1 % 2. value at tc = 25c typical operation characteristics (ta = 25c) item symbol min typ max unit test conditions v ih ?3.5 ? ? v input voltage v il ? ? ?1.2 v i ih1 ? ? ?100 a vi = ?8 v, v ds = 0 i ih2 ? ? ?50 a vi = ?3.5 v, v ds = 0 input current (gate non shut down) i il ? ? ?1 a vi = ?1.2 v, v ds = 0 i ih(sd)1 ? ?0.8 ? ma vi = ?8 v, v ds = 0 input current (gate shut down) i ih(sd)2 ? ?0.35 ? ma vi = ?3.5 v, v ds = 0 shut down temperature tsd ? 175 ? c channel temperature gate operation voltage vop ?3.5 ? ?12 v
haf1009(l), haf1009(s) rev.1.00, may.13.2 003, page 3 of 10 electrical characteristics (ta = 25c) item symbol min typ max unit test conditions drain current i d1 ?10 ? ? a v gs = ?3.5, v ds = ?2 v drain current i d2 ? ? ?10 ma v gs = ?1.2v, v ds = ?2 v drain to source breakdown voltage v (br)dss ?60 ? ? v i d = ?10 ma, v gs = 0 gate to source breakdown voltage v (br)gss ?16 ? ? v i g = ?800 a, v ds = 0 gate to source breakdown voltage v (br)gss 2.5 ? ? v i g = 100 a, v ds = 0 i gss1 ? ? ?100 a v gs = ?8 v, v ds = 0 i gss2 ? ? ?50 a v gs = ?3.5 v, v ds = 0 i gss3 ? ? ?1 a v gs = ?1.2 v, v ds = 0 gate to source leak current i gss4 ? ? 100 a v gs = 2.4 v, v ds = 0 i gs(op)1 ? ?0.8 ? ma v gs = ?8 v, v ds = 0 input current (shut down) i gs(op)2 ? ?0.35 ? ma v gs = ?3.5 v, v ds = 0 zero gate voltage drain current i dss ? ? ?10 a v ds = ?60 v, v gs = 0 gate to source cutoff voltage v gs(off) ?1.1 ? ?2.15 v v ds = ?10 v, i d = ?1 ma forward transfer admittance |y fs | 8.4 14.8 ? s i d = ?20 a, v ds = ?10 v note3 static drain to source on state r ds(on) ?3350m ? i d = ?20 a, v gs = ?4 v note3 resistance r ds(on) ?2027m ? i d = ?20 a, v gs = ?10 v note3 output capacitance coss ? 1500 ? pf v ds = ?10 v, v gs = 0, f = 1 mhz turn-on delay time td(on) ? 10.6 ? s rise time tr ? 45 ? s turn-off delay time td(off) ? 12 ? s fall time tf ? 13 ? s v gs = -10 v, i d = ?20 a, r l = 1.5 ? body?drain diode forward voltage v df ? ?0.95 ? v i f = ?40 a, v gs = 0 body?drain diode reverse recovery time trr ? 100 ? ns i f = ?40 a, v gs = 0 dif/dt = 50 a/s over load shut down t os1 ?4.1?msv gs = ?5 v, v dd = ?16 v operation time note4 t os2 ?1.5?msv gs = ?5 v, v dd = ?24 v notes: 3. pulse test 4. including the junction temperature ri se of the over loaded condition.
haf1009(l), haf1009(s) rev.1.00, may.13.2 003, page 4 of 10 main characteristics -100 -200 -500 -20 -50 -10 -2 -5 -1 -0.5 -0.3 -0.5 -1 -2 -5 -10 -20 -50 -10 0 drain to source voltage v ds (v) drain current i d (a) maximum safe operation area -50 -40 -30 -20 -10 0 -2 -4 -6 -8 -10 -10 v v = -3.5 v gs drain to source voltage v ds (v) drain current i d (a) typical output characteristics 0 -2 -4 -6 -8 -10 tc = -25 c 75 c tc = -25 c 25 c 75 c gate to source voltage v gs (v) drain current i d (a) typical transfer characteristics 100 s 1 ms pw = 10 m s dc operation (tc = 25 c) ta = 25 c -50 -40 -30 -20 -10 -8 v -6 v -5 v -4 v pulse test v = -10 v ds pulse test 80 60 40 20 0 50 100 150 200 channel dissipation pch (w) case temperature tc ( c) power vs. temperature derating 25 c thermal shut down operation area operation in this area is limited by r ds(on)
haf1009(l), haf1009(s) rev.1.00, may.13.2 003, page 5 of 10 -1.6 -2.0 -1.2 -0.8 -0.4 0 -2 -4 -6 -8 -10 pulse test gate to source voltage v gs (v) drain to source saturation voltage vs. gate to source voltage drain to source saturation voltage v ds(on) (v) 50 100 -0.1 -0.5 -1 -5 -10 -50 -100 20 10 2 5 1 drain current i d (a) static drain to source sate resistance vs. drain current 100 80 60 40 20 -25 0 25 50 75 100 125 150 0 pulse test case temperature tc ( c) drain to source on state resistance r ds(on) (m ? ) drain to source on state resistance r ds(on) (m ? ) static drain to source on state resistance vs. temperature 100 20 10 50 drain current i d (a) forward transfer admittance vs. drain current forward transfer admittance |yfs| (s) -20 a i = -40 a d -10 a v = -10 v gs v = -4 v gs -10 a i = -40 a d -20 a -10 a -20 a -40 a -0.1 -1 -10 -100 5 2 1 0.1 0.2 0.5 tc = -25 c 25 c 75 c ds v = -10 v pulse test v = -4 v gs -10 v pulse test
haf1009(l), haf1009(s) rev.1.00, may.13.2 003, page 6 of 10 reverse drain current i dr (a) reverse recovery time trr (ns) body to drain diode reverse recovery time drain current i d (a) switching time t ( s) switching characteristics -50 -40 -30 -20 -10 0 -0.4 -0.8 -1.2 -1.6 -2.0 gs v = 0 v -5 v -10 v source to drain voltage v sd (v) reverse drain current i dr (a) reverse drain current vs. source to drain voltage pulse test 10000 1000 100 0 -10 -20 -30 -40 -60 -50 capacitance c (pf) drain to source voltage v ds (v) typical capacitance vs. drain to source voltage 500 -0.1 -0.5 -1 -5 -50 -10 -100 200 100 1000 20 50 10 di / dt = 50 a / s v = 0, ta = 25 c gs 50 -0.1 -0.2 -0.5 -1 -2 -20 -5 -50 -10 -100 20 10 5 2 1 500 200 100 1000 r t v = -10 v, v = -30 v pw = 300 s, duty < 1 % gs dd t f d(off) t v = 0 f = 1 mhz gs d(on) t
haf1009(l), haf1009(s) rev.1.00, may.13.2 003, page 7 of 10 -2 -4 -12 -10 -8 -6 0 gate to source voltage v gs (v) gate to source voltage vs. shutdown time of load-short test 0.1 shutdown time of load-short test pw (s) 0.0001 0.001 0.01 -24v v dd = -16 v 200 180 160 140 120 -0 gate to source voltage v gs (v) shutdown case temperature tc ( c) 100 -2 -4 -6 -8 -10 i d = -5 a shutdown case temperature vs. gate to source voltage 3 1 0.3 0.1 0.03 0.01 10 100 1 m 10 m 100 m 1 10 dm p pw t d = pw t ch - c(t) = s (t) ? ch - c ch - c = 2.5 c/w, tc = 25 c tc = 25 c d = 1 0.5 0.2 0.1 0.05 0.02 0.01 1shot p ulse pulse width pw (s) normalized transient thermal impedance s (t) normalized transient thermal impedance vs. pulse width
haf1009(l), haf1009(s) rev.1.00, may.13.2 003, page 8 of 10 package dimensions package code jedec jeita mass (reference value) ldpak (l) ? ? 1.40 g 10.2 0.3 0.86 0.76 0.1 2.54 0.5 2.54 0.5 + 0.2 ? 0.1 1.3 0.2 4.44 0.2 1.3 0.15 2.49 0.2 0.4 0.1 11.0 0.5 8.6 0.3 10.0 11.3 0.5 + 0.3 ? 0.5 (1.4) 1.37 0.2 as of january, 2003 unit: mm
haf1009(l), haf1009(s) rev.1.00, may.13.2 003, page 9 of 10 package code jedec jeita mass (reference value) ldpak (s)-(1) ? ? 1.30 g 10.2 0.3 1.37 0.2 (1.5) (1.4) 8.6 0.3 10.0 + 0.3 ? 0.5 4.44 0.2 1.3 0.15 0.1 + 0.2 ? 0.1 0.4 0.1 2.49 0.2 0.86 + 0.2 ? 0.1 2.54 0.5 2.54 0.5 1.3 0.2 3.0 + 0.3 ? 0.5 (1.5) 7.8 6.6 2.2 1.7 7.8 7.0 as of january, 2003 unit: mm
haf1009(l), haf1009(s) rev.1.00, may.13.2 003, page 10 of 10 keep safety first in your circuit designs! 1. renesas technology corporation puts the maximum effort into making semiconductor products better and more reliable, but ther e is always the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corporation p roduct best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas technology corporat ion or a third party. 2. renesas technology corporation assumes no responsibility for any damage, or infringement of any third-party's rights, origin ating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents i nformation on products at the time of publication of these materials, and are subject to change by renesas technology corporation without notice due to product improvements or other reas ons. it is therefore recommended that customers contact renesas technology corporation or an authorized renesas technology corporation product distributor for the latest produ ct information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracie s or errors. please also pay attention to information published by renesas technology corporation by various means, including the renesas te chnology corporation semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, a nd algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp oration assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corporation semiconductors are not designed or manufactured for use in a device or system that is used un der circumstances in which human life is potentially at stake. please contact renesas technology corporation or an authorized renesas technology corporation product distributor wh en considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or u ndersea repeater use. 6. the prior written approval of renesas technology corporation is necessary to reprint or reproduce in whole or in part these materials. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lic ense from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is pro hibited. 8. please contact renesas technology corporation for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com copyright ? 2003. renesas technology corporation, all rights reserved. printed in japan. colophon 0.0


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